AAEON’s first SMARC module featuring Qualcomm technology, the uCOM-Q6490 is a small and lightweight platform for integration in robotics, healthcare, and automation applications.
(Taipei, Taiwan – August 21, 2026) Industrial IoT solutions provider AAEON (Stock Code: 6579) today announced the release of the uCOM-Q6490, a SMARC module powered by Qualcomm Dragonwing™ QCS6490 processors.
The uCOM-Q6490, which is AAEON’s first product to make use of Qualcomm technology, comes with Qualcomm Dragonwing™ QCS6490 processors, with heterogenous compute featuring an 8-core Qualcomm® Kryo™ 670 CPU built on Arm® v8 Cortex® technology and 12 TOPS of AI performance through platform’s integrated Qualcomm® Hexagon™ 770 NPU.
The module comes with up to 16GB of soldered LPDDR5, with storage options including both 64GB of UFS and SDIO 3.0 for SD card support. For expansion, the uCOM-Q6490 provides a PCIe Gen 3 interface.
Built on the 82mm x 50mm SMARC 2.1 standard, the uCOM-Q6490 is a compact, lightweight, and designed to offer a variety of interfaces in a format that can be easily integrated into host systems. Both digital signage systems and portable healthcare imaging devices have been noted as potential target verticals, given the module’s display port interface, fanless design, and Qualcomm® Adreno™ 643 GPU and VPU, which provides multi-format video encode and video playback support.
AAEON also indicates that the uCOM-Q6490 may have potential in the robotics sphere. Particularly useful I/Os offered by the module include dual Gigabit Ethernet, three I2C, and a total of five USB interfaces. This selection offers support for LiDAR, IMUs, robotic controllers, cameras, and other relevant peripheral devices. Meanwhile, the module’s two SPI interfaces serve to provide the kind of low-latency, deterministic communication needed to support embedded robotics sensors.
While the module lists a default operating temperature of 0°C to 60°C, AAEON notes that it can offer temperature tolerance as broad as -40°C to 85°C upon request.
